8 Megabit Multi-Purpose Flash
SST39VF800Q / SST39VF800
Advance Information
PACKAGING DIAGRAMS
1.10
0.90
PIN # 1 IDENT. DIA. 1.00
1.05
0.95
12.20
11.80
.50
BSC
.270
.170
18.50
18.30
0.15
0.05
0.70
0.50
20.20
19.80
Note:
1. Complies with JEDEC publication 95 MO-142 DD dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in metric (min/max).
3. Coplanarity: 0.1 (±.05) mm.
48.TSOP-EK-ILL.0
48-LEAD THIN SMALL OUTLINE PACKAGE (TSOP)
SST PACKAGE CODE: EK
TOP VIEW
PIN 1 CORNER
123456
BOTTOM VIEW
PIN 1 CORNER
0.30 ± 0.05 (48X)
654321
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
SIDE VIEW
0.80
4.00
8.00 ± 0.20
SEATING PLANE
48pn TFBGA.8x10-ILL.2
48-BALL THIN FINE-PITCH BALL GRID ARRAY (TFBGA)
SST PACKAGE CODE: BK
© 1999 Silicon Storage Technology, Inc.
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343-04 2/99