SST39VF088 Ver la hoja de datos (PDF) - Silicon Storage Technology
Número de pieza
componentes Descripción
Fabricante
SST39VF088 Datasheet PDF : 22 Pages
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8 Mbit Multi-Purpose Flash
SST39VF088
PACKAGING DIAGRAMS
Pin # 1 Identifier
Preliminary Specifications
12.20
11.80
1.05
0.95
0.50
BSC
0.27
0.17
18.50
18.30
0.15
0.05
0.70
0.50
20.20
19.80
1.20
max.
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
48-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 12MM X 20MM
SST PACKAGE CODE: EK
DETAIL
0˚- 5˚
0.70
0.50
1mm
48-tsop-EK-8
TABLE 11: REVISION HISTORY
Number
00
•
01
•
02
•
03
•
04
•
Description
Initial Release
Corrected Byte-Program 3rd Cycle Data from 20H to A0H in Table 4 on page 6
Corrected Byte-Program 3rd Cycle Data from 20H to A0H in Figures 3 and 4
Auto Low Power feature references removed.
(CE# toggled high achieves same effect.)
2004 Data Book
Date
Mar 2003
Apr 2003
Jun 2003
Aug 2003
Nov 2003
©2003 Silicon Storage Technology, Inc.
21
S71227-04-000
11/03
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