SSF2316E Ver la hoja de datos (PDF) - Silikron Semiconductor Co.,LTD.
Número de pieza
componentes Descripción
Fabricante
SSF2316E Datasheet PDF : 5 Pages
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SSF2316E
DFN3×3-8L PACKAGE INFORMATION
TOP VIEW
BOTTOM VIEW
SIDE VIEW
COMMON DIMENSIONS(MM)
PKG.
W： VERY VERY THIN
REF.
MIN.
NOM.
MAX.
A
0.70
0.75
0.80
A1
0.00
－
0.05
A3
0.2REF.
D
2.95
3.00
3.05
E
2.95
3.00
3.05
b
0.25
0.30
0.35
L
0.30
0.40
0.50
D2
2.30
2.45
2.55
E2
2.50
1.65
1.75
e
0.65BSC
NOTES：
1. Dimensions are inclusive of plating
2. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils.
3. Dimension L is measured in gauge plane.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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