SP813L Ver la hoja de datos (PDF) - Signal Processing Technologies
Número de pieza
componentes Descripción
Fabricante
SP813L Datasheet PDF : 18 Pages
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PACKAGE: PLASTIC
MICRO SMALL
OUTLINE (µSOIC)
0.0965
±0.003
0.0256
BSC
0.012
±0.003
12.0˚
±4˚
0.118
±0.004
R .003
0.16
±0.003
0.008
0˚ - 6˚
0.006
±0.006
0.006
±0.006
0.020
0.020
12
12.0˚
±04.˚01
0.0215
±0.006
3.0˚
±3˚
0.037
Ref
0.116
±0.004
0.013
±0.005
0.118
±0.004
0.034
±0.004
0.040
±0.003
0.004
±0.002
0.116
±0.004
0.118
±0.004
All package dimensions in inches
50 µSOIC devices per tube
SP705DS/09
SP705 Low Power Microprocessor Supervisory Circuits
17
© Copyright 2000 Sipex Corporation
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