SP813M Ver la hoja de datos (PDF) - Signal Processing Technologies

Número de pieza

componentes Descripción

Fabricante

SP813M

Low Power Microprocessor Supervisory Circuits

Signal Processing Technologies 

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(NARROW)

EH

D

e

B

A

A1

h x 45°

Ø

L

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

8–PIN

A

0.053/0.069

(1.346/1.748)

A1

0.004/0.010

(0.102/0.249

B

0.014/0.019

(0.35/0.49)

D

0.189/0.197

(4.80/5.00)

E

0.150/0.157

(3.802/3.988)

e

0.050 BSC

(1.270 BSC)

H

0.228/0.244

(5.801/6.198)

h

0.010/0.020

(0.254/0.498)

L

0.016/0.050

(0.406/1.270)

Ø

0°/8°

(0°/8°)

SP705DS/09

SP705 Low Power Microprocessor Supervisory Circuits

16

© Copyright 2000 Sipex Corporation

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