RT9709 Ver la hoja de datos (PDF) - Richtek Technology

Número de pieza

componentes Descripción

Fabricante

RT9709

Integrated Over Voltage Protection Circuit

Richtek Technology 

RT9709

` VIN traces should be wide enough to minimize

inductance and handle the high currents. The trace

running from input to chip should be placed carefully

and shielded strictly.

` Input and output capacitors must be placed close to the

part. The connection between pins and capacitor pads

should be copper traces without any through-hole via

connection.

Output capacitor must be

placed between GND and VIN

to reduce noise.

Output capacitor must be

placed between GND and

VOUT to reduce noise.

GND

CIN

VIN 1

VIN 2

GND 3

WRN 4

NC 5

GND

11

10 VOUT

9 VOUT

8 ILIM

7 VB

EN

COUT

RVB

RILIM

GND

The exposed pad and GND should be connected to a

strong ground plane for heat sinking and noise prevention .

Figure 2. Recommended PCB Layout

www.richtek.com

10

DS9709-02 April 2011

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