RT8282B Ver la hoja de datos (PDF) - Richtek Technology
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componentes Descripción
Fabricante
RT8282B Datasheet PDF : 14 Pages
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RT8282B
(d) Copper Area = 50mm2 , θJA = 51°C/W
(e) Copper Area = 70mm2 , θJA = 49°C/W
Figure 6. Themal Resistance vs. Copper Area Layout Design
Layout Consideration
For best performance of the RT8282B, the follow layout
guidelines must be strictly followed.
` Input capacitor must be placed as close to the IC as
possible.
` SW should be connected to inductor by wide and short
trace. Keep sensitive components away from this trace.
` The feedback components must be connected as close
to the device as possible
GND
Input capacitor must
be placed as close
to the IC as possible.
COUT
VOUT
VIN
CIN
SW GND
The feedback components
must be connected as close
to the device as possible.
CSS
CC
RS CS
BOOT
VIN
SW
GND
8
2
7
GND
3
6
9
4
5
SS REN VIN
EN
COMP
R1
FB
CP RC
L1
R2 VOUT
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
GND
Figure 8. PCB Layout Guide
Location
CIN
CIN
CIN
COUT
COUT
COUT
COUT
Table 3. Suggested Capacitors for CIN and COUT
Component Supplier
Part No.
Capacitance (μF)
MURATA
GRM31CR61E106K
10
TDK
C3225X5R1E106K
10
TAIYO YUDEN
TMK316BJ106ML
10
MURATA
GRM31CR60J476M
47
TDK
C3225X5R0J476M
47
MURATA
GRM32ER71C226M
22
TDK
C3225X5R1C22M
22
Case Size
1206
1206
1206
1206
1210
1210
1210
DS8282B-01 March 2011
www.richtek.com
13
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