LVR005K Ver la hoja de datos (PDF) - Tyco Electronics
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LVR005K Datasheet PDF : 27 Pages
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Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices ... Cont'd
RTEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Tin-plated copper-clad steel, 0.205mm2 (24AWG), ø0.40mm (0.016in.)
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
RTEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RUEF
Physical Characteristics
Lead material
RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm2 (24AWG)
RUEF300 to RUEF900: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)
Soldering characteristics
Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand
Insulting material
per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RUEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RUSBF
Physical Characteristics
Lead material
RUSBF075: Tin-plated nickel-copper alloy, 0.205mm2 (24AWG), ø0.51mm/0.020in.
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm2 (24AWG), ø0.51mm/0.020in.
Soldering characteristics
Solderability pre ANSI/J-STD-002 Category 3 except
RUSBF075 meet ANSI/J-STD-002 Category 1
Solder heat withstand
Insulting material
RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
All others: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RUSBF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RGEF
Physical Characteristics
Lead material
RGEF300 to RGEF1100: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm/0.032in.
RGEF1200 to RGEF1400: Tin-plated copper, 0.82mm2 (18AWG), ø1.0mm/0.04in.
Soldering characteristics
Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand
Insulting material
RGEF300K and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
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