RF3196SB Ver la hoja de datos (PDF) - RF Micro Devices
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RF3196SB Datasheet PDF : 16 Pages
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RF3196
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.40 Sq. Typ.
B = 0.80 x 0.40 Typ.
C = 0.40 x 0.80
Dimensions in mm.
A = 0.55 x 0.95
B = 0.55 Sq. Typ.
C = 0.95 x 0.55 Typ.
D = 1.80 x 4.62
E = 0.60 Sq. Typ.
Pin 1
5.20
C
4.10
A
3.30
A
2.50
B
1.80
1.40
0.80
A
0.00
A
5.60
B
5.40
4.90
0.60
A
0.20
5.20 Pin 1
TYP
A
4.10
B
3.30
B
2.50
C
1.60
B
0.80
B
0.00
B
E
C
EE B
EE B
EE B
D
EE B
EE B
EE B
EE B
5.40
4.62
3.85
3.07
2.76
2.30
1.52
0.75
Metal Land Pattern
Figure 1. PCB Metal Land and Solder Mask Patterns (Top View)
Solder Mask Pattern
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
Rev A2 DS071207
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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