DA9123.002
26 September, 2000
u Power Dissipation
Parameter
Symbol
Conditions
Min Typ Max Unit
Thermal Resistance
(Junction-to-Air)
RJA
typical PC board mounting,
still air
255.9
°C/W
Maximum Power Dissipation
Pd
any ambient temperature
PdMAX
=
TJ(MAX) − TA
R JA
mW
Note 1
Note 1: TJ(MAX) denotes maximum operating junction temperature (+125°C), TA ambient temperature, and RJA junction-to-air thermal
resistance (+255.9°C/W).
u Line and Load Regulation
Parameter
Line Regulation
Symbol
Load Regulation
u Noise and Ripple Rejection
Parameter
Output Noise Voltage
Symbol
VRMS
Noise Density
VN
PSRR
Conditions
VOUT + 1 V < VIN < 5.3 V
IOUT = 50 mA
IOUT = 1.0 to 50 mA
Conditions
10 Hz < f < 100 kHz,
CBYPASS = 10 nF
IOUT = 50 mA,
f = 10 kHz
CBYPASS = 10 nF
CBYPASS = 10 nF
f = 1 kHz
f = 10 kHz
f = 100 kHz
Min Typ Max Unit
0.75 2
mV
13.5 25
mV
Min Typ Max Unit
µVrms
9.5
nV
sqrt(Hz)
24
dB
70
68
58
u Dynamic Parameters
Parameter
Rise Time (from start-up to
80% of VNOM)
Overshoot
Start-up Time
(settling time of voltage
transient from start-up to
within ±1% of VNOM)
Symbol
Conditions
Min
VCTRL = 0 to 2.4 V, IOUT = 50 mA,
CL 1.0 µF
CBYPASS = 10 nF
VCTRL = 0 to 2.4 V
CBYPASS = 10 nF
VCTRL = 0 to 2.4 V, IOUT = 50 mA
CL µF
CBYPASS = 10 nF
Typ
7.5
1.0
20
Max
8.0
Unit
µs
%
µs
4 (10)