PM6681A(2006) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

PM6681A
(Rev.:2006)

Dual step-down controller with adjustable LDO

STMicroelectronics 

PM6681A

4

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 2. VFQFPN 5x5x1.0 32L Pitch 0.50

Dim.

Databook (mm)

Min

Typ

Max

A

0.8

0.9

1

A1

0

0.02

0.05

A3

0.2

b

0.18

0.25

0.3

D

4.85

5

5.15

D2

See exposed pad variations (2)

E

4.85

5

5.15

E2

See exposed pad variations (2)

e

0.5

L

0.3

0.4

0.5

ddd

0.05

Table 3. Exposed pad variations

(1)(2)D2

E2

Min

Typ

Max

Min

Typ

Max

2.90

3.10

3.20

2.90

3.10

3.20

1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. Very thin:

A = 1.00mm Max.

2. Dimensions D2 & E2 are not in accordance with JEDEC.

9/12

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