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PCF8594C-2T/02 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
PCF8594C-2T/02
NXP
NXP Semiconductors. NXP
PCF8594C-2T/02 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Philips Semiconductors
14. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
PCF8594C-2
512 × 8-bit CMOS EEPROM with I2C-bus interface
SOT97-1
D
L
Z
e
b
8
A2 A
A1
wM
b1
b2
5
pin 1 index
E
ME
c
(e 1)
MH
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
min. max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73 0.53 1.07 0.36
1.14 0.38 0.89 0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches 0.17
0.02
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
JEITA
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 14. DIP8 package outline (SOT97-1).
9397 750 14221
Product data
Rev. 05 — 25 October 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
14 of 21

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