BTemperature Profile
10s max
240
230
200
180
150
0
120s max
Preheating Time
40s max
40s max
Soldering time
Time
q Applicable Conditions
Reflow system : IR reflow
Solder
: Paste type 63 Sn/37 Pb
(Flux content 9 wt%)
Test board Glass epoxy 47mm x 77.3mm x 0.5 mm
Metal mask thickness: 0.15 mm
q Recommended temperature profile.
The temperature may be slightly changed according to
the solder paste type and amount.
B22