NX-CSA Ver la hoja de datos (PDF) - HIROSE ELECTRIC

Número de pieza

componentes Descripción

Fabricante

NX-CSA

I/O Card Interface Connectors

HIROSE ELECTRIC 

BTemperature Profile

10s max

240

230

200

180

150

0

120s max

Preheating Time

40s max

40s max

Soldering time

Time

q Applicable Conditions

Reflow system : IR reflow

Solder

: Paste type 63 Sn/37 Pb

(Flux content 9 wt%)

Test board Glass epoxy 47mm x 77.3mm x 0.5 mm

Metal mask thickness: 0.15 mm

q Recommended temperature profile.

The temperature may be slightly changed according to

the solder paste type and amount.

B22

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