NUP2114(2012) Ver la hoja de datos (PDF) - ON Semiconductor
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NUP2114 Datasheet PDF : 6 Pages
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NUP2114 Series, SNUP2114UCMR6T1G
PACKAGE DIMENSIONS
D
65 4
E1
ÉÉÉÉÉÉ 1 2 3
E
NOTE 5
b
e
0.05
A
A1
TSOP−6
CASE 318G−02
ISSUE U
H
L2
GAUGE
PLANE
L
M
DETAIL Z
C
SEATING
PLANE
c
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b
0.25
0.38
0.50
c
0.10
0.18
0.26
D 2.90
3.00
3.10
E 2.50
2.75
3.00
E1 1.30
1.50
1.70
e
0.85
0.95
1.05
L
0.20
0.40
0.60
L2
0.25 BSC
M
0
−
10
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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