NE5550234 Ver la hoja de datos (PDF) - Renesas Electronics

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componentes Descripción

Fabricante

NE5550234

Silicon Power MOS FET

Renesas Electronics 

NE5550234

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Infrared Reflow

Wave Soldering

Partial Heating

Soldering Conditions

Peak temperature (package surface temperature) : 260°C or below

Time at peak temperature

: 10 seconds or less

Time at temperature of 220°C or higher

: 60 seconds or less

Preheating time at 120 to 180°C

: 120±30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below

Peak temperature (molten solder temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

Preheating temperature (package surface temperature)

: 120°C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below

Peak temperature (terminal temperature)

Soldering time (per side of device)

: 350°C or below

: 3 seconds or less

Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below

Condition Symbol

IR260

WS260

HS350

CAUTION

Do not use different soldering methods together (except for partial heating).

R09DS0039EJ0300 Rev.3.00

Mar 12, 2013

Page 14 of 14

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