1000
100
10
1
NCV4299
SOIC 8 LEAD
Cu Area = 10 mm2, 1.0 oz
25 mm2, 1.0 oz
100 mm2, 1.0 oz
250 mm2, 1.0 oz
500 mm2, 1.0 oz
0.1
0.000001 0.00001 0.0001
0.001
0.01
0.1
1
Time (sec)
10
100
Figure 44. Transient Thermal Response Simulation to a Single Pulse 1 oz (Log−Log)
1000
1000
50% Duty Cycle
100 20%
10%
10 5%
2%
1 1%
0.1 Single Pulse (SOIC−8)
0.01
Psi LA (SOIC−8)
0.001
0.000001 0.00001 0.0001
0.001
0.01
0.1
1
Pulse Time (sec)
10
100
1000
Figure 45. Transient Thermal Response Simulation to a Single Pulse with Duty Cycles Applied (Log−Log)
(PCB = 50 mm2 1 oz)
1000
100 50% Duty Cycle
20%
10%
10
5%
2%
1 1%
0.1 Single Pulse (SOIC−8)
0.01
Psi LA (SOIC−8)
0.001
0.000001 0.00001 0.0001
0.001
0.01
0.1
1
Pulse Time (sec)
10
100
1000
Figure 46. Transient Thermal Response Simulation to a Single Pulse with Duty Cycles Applied (Log−Log)
(PCB = 250 mm2 1 oz)
http://onsemi.com
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