MSM6562B Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Fabricante
MSM6562B Datasheet PDF : 50 Pages
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¡ Semiconductor
PAD CONFIGURATION
Pad Layout
Chip Size : 7.12 ¥ 4.09 mm
Y
Pad Size : 100 ¥ 100 mm
(PV Hole) 210 ¥ 100 mm (VDD, VSS)
Chip Thickness : 525 ± 20 mm
122
123
MSM6562B-xx
76
75
X
Note :
149
1
The chip substrate should be
connected to VDD or left open.
Pad Coordinates
Pad
Symbol
X (µm) Y (µm)
Pad
1
T2
–3275 –1900
21
2
T3
–3135 –1900
22
3
VSS
–2940 –1900
23
4
COM1
–2745 –1900
24
5
COM2
–2605 –1900
25
6
COM3
–2465 –1900
26
7
COM4
–2325 –1900
27
8
COM5
–2185 –1900
28
9
COM6
–2045 –1900
29
10
COM7
–1905 –1900
30
11
COM8
–1765 –1900
31
12
COM9
–1625 –1900
32
13
COM10
–1485 –1900
33
14
COM11
–1345 –1900
34
15
COM12
–1205 –1900
35
16
COM13
–1065 –1900
36
17
COM14
–925 –1900
37
18
COM15
–785 –1900
38
19
COM16
–645 –1900
39
20
SEG100
–505 –1900
40
47 48
Symbol
SEG99
SEG98
SEG97
SEG96
SEG95
SEG94
SEG93
SEG92
SEG91
SEG90
SEG89
SEG88
SEG87
SEG86
SEG85
SEG84
SEG83
SEG82
SEG81
SEG80
X (µm)
–365
–225
–85
55
195
335
475
615
755
895
1035
1175
1315
1455
1595
1735
1875
2015
2155
2295
Y (µm)
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
–1900
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