-A-
5
N -B-
8
S
J
K
PACKAGE DIMENSIONS
D 8 PL
4
0.25 (0.010) M T B S A S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.500 0.520
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M 0˚
7˚
N 0.444 0.448
S 0.709 0.725
V 0.245 0.255
W 0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚
7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
-A-
5
N -B-
8
S
J
4
G
D 8 PL
0.25 (0.010) M T B S A S
1
DETAIL X
W
V
C
PIN 1
IDENTIFIER
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
C 0.500 0.520 12.70 13.21
D 0.026 0.034 0.66 0.864
G 0.100 BSC
2.54 BSC
J 0.009 0.011 0.23 0.28
K 0.100 0.120 2.54 3.05
M 0˚
15˚ 0˚
15˚
N 0.444 0.448 11.28 11.38
S 0.540 0.560 13.72 14.22
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
M
DETAIL X
-T-
SEATING
PLANE
K
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
Sensors
Freescale Semiconductor
MPX5100
7