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MPC7455

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Electrical and Thermal Characteristics

Table 6. DC Electrical Specifications (continued)

At recommended operating conditions. See Table 4.

Characteristic

Nominal

Bus Symbol

Min

Voltage 1

Max

Unit Notes

Input leakage current,

—

Vin = GVDD/OVDD + 0.3 V

High impedance (off-state) leakage

—

current, Vin = GVDD/OVDD + 0.3 V

Output high voltage, IOH = –5 mA

1.5

1.8

2.5

Output low voltage, IOL = 5 mA

1.5

1.8

2.5

Capacitance, L3 interface

—

Vin = 0 V,

f = 1 MHz

All other inputs

Iin

—

ITSI

—

VOH

VOH

VOH

VOL

VOL

VOL

Cin

GVDD – 0.45

OVDD/GVDD – 0.45

1.7

—

—

—

—

—

30

30

—

—

—

0.45

0.45

0.7

9.5

8.0

µA 2, 3

µA 2, 3, 5

V

6

V

V

V

6

V

V

pF

4

pF

4

Notes:

1. Nominal voltages; see Table 4 for recommended operating conditions.

2. For processor bus signals, the reference is OVDD while GVDD is the reference for the L3 bus signals.

3. Excludes test signals and IEEE 1149.1 boundary scan (JTAG) signals.

4. Capacitance is periodically sampled rather than 100% tested.

5. The leakage is measured for nominal OVDD/GVDD and VDD, or both OVDD/GVDD and VDD must vary in the same

direction (for example, both OVDD and VDD vary by either +5% or –5%).

6. Applicable to L3 bus interface only.

Table 7 provides the power consumption for the MPC7455.

Table 7. Power Consumption for MPC7455

Processor (CPU) Frequency

733 MHz 867 MHz 933 MHz 1 GHz

Typical

Maximum

Typical

Typical

Full-Power Mode

11.5

12.9

13.6

15.0

17.0

19.0

20.0

22.0

Doze Mode

—

—

—

—

Nap Mode

8.0

8.0

8.0

8.0

Sleep Mode

Unit Notes

W

1, 3

W

1, 2

W

4

W

1, 3

MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1

14

Freescale Semiconductor

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