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MPC7448EC

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Package Description

8 Package Description

The following sections provide the package parameters and mechanical dimensions for the HCTE

package.

8.1 Package Parameters for the MPC7448, 360 HCTE BGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead

high coefficient of thermal expansion ceramic ball grid array (HCTE).

Package outline

25 × 25 mm

Interconnects

360 (19 × 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height 2.32 mm

Maximum module height 2.80 mm

Ball diameter

0.89 mm (35 mil)

Coefficient of thermal expansion12.3 ppm/°C

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

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