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MPC7448

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7448. For more information regarding

thermal management, see Section 9.7, “Power and Thermal Management Information.”

Table 5. Package Thermal Characteristics1

Characteristic

Symbol Value Unit Notes

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board

RθJA

26 •C/W 2, 3

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board

RθJMA

19 •C/W 2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board

RθJMA

22 •C/W 2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board

RθJMA

16 •C/W 2, 4

Junction-to-board thermal resistance

RθJB

11 •C/W

5

Junction-to-case thermal resistance

RθJC

< 0.1 •C/W

6

Notes:

1. Refer to Section 9.7, “Power and Thermal Management Information,” for details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

3. Per JEDEC JESD51-2 with the single-layer board horizontal

4. Per JEDEC JESD51-6 with the board horizontal

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

Table 6 provides the DC electrical characteristics for the MPC7448.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Input high voltage

(all inputs)

Input low voltage

(all inputs)

Input leakage current, all signals except

BVSEL0, LSSD_MODE, TCK, TDI, TMS,

TRST:

Vin = OVDD

Vin = GND

Input leakage current, BVSEL0,

LSSD_MODE, TCK, TDI, TMS, TRST:

Vin = OVDD

Vin = GND

Nominal Bus

Voltage 1

Symbol

Min

Max

Unit Notes

1.5

VIH OVDD × 0.65 OVDD + 0.3 V

2

1.8

OVDD × 0.65 OVDD + 0.3

2.5

1.7

OVDD + 0.3

1.5

VIL

–0.3

OVDD × 0.35 V

2

1.8

–0.3

OVDD × 0.35

2.5

–0.3

0.7

—

Iin

—

µA 2, 3

50

– 50

—

Iin

—

µA 2, 6

50

– 2000

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

12

Freescale Semiconductor

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