MMA7368L Ver la hoja de datos (PDF) - Freescale Semiconductor

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Fabricante

MMA7368L

±1.5g Three Axis Low-g Micromachined Accelerometer

Freescale Semiconductor 

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

PCB Mounting Recommendations

MEMS based sensors are sensitive to Printed Circuit

Board (PCB) reflow processes. For optimal zero-g offset after

PCB mounting, care must be taken to PCB layout and reflow

conditions. Reference application note AN3484 for best

practices to minimize the zero-g offset shift after PCB

mounting.

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package.

With the correct footprint, the packages will self-align when

subjected to a solder reflow process. It is always

recommended to design boards with a solder mask layer to

avoid bridging and shorting between solder pads.

1

10x0.8

13

6x2

6

14x0.6

14x0.9

8

12x1

MMA7368L

8

Sensors

Freescale Semiconductor

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