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ML9209 Ver la hoja de datos (PDF) - Oki Electric Industry

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ML9209 Datasheet PDF : 29 Pages
First Prev 21 22 23 24 25 26 27 28 29
OKI Semiconductor
PACKAGE DIMENSIONS
QFP44-P-910-0.80-2K
FEDL9209-01
ML9209-xx
(Unit: mm)
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Sn/Pb
0.41 TYP.
5/Nov. 20, 2002
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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