Pad Configuration
ML2002 Preliminary
Chip Size :
Part Number Description
ML2002-1U One ML2002 LCD driver
ML2002-2U Two ML2002 LCD driver
Chip Size
3660 x 660
7320 x 660
Chip Thickness : 700 um + 25 um
Gold Bump Pad Size : 32 um x 72 um
Gold Bump Height : 18 um + 2 um
Note :
The die faces up in the diagram
P6/13
Preliminary, November 2008