10-40GHz Frequency Multiplier
Chip Assembly and Mechanical data
Vg1, Vg2
Vg3
Vd
100PF
100PF
100PF
CHX2092a
IN
x2
x2
OUT
Note: Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Pad Size: 100 x 100µm
970 +/ -
x2
x2
Bonding pad positions
(Chip thickness: 100µm. All dimensions are in micrometers)
Ref. : DSCHX2092a7152 - 01 Jun 07
5/6
Specifications subject to change without notice
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