MCP23016 Ver la hoja de datos (PDF) - Microchip Technology
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MCP23016 Datasheet PDF : 38 Pages
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MCP23016
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
EXPOSED
D2
PAD
N
TOP VIEW
E
2
1
E2
2
1
NOTE 1
N
L
BOTTOM VIEW
e
b
K
A
A3
A1
Units
MILLIMETERS
Dimension Limits MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
6.00 BSC
Exposed Pad Width
E2
3.65
3.70
4.20
Overall Length
D
6.00 BSC
Exposed Pad Length
D2
3.65
3.70
4.20
Contact Width
b
0.23
0.30
0.35
Contact Length
L
0.50
0.55
0.70
Contact-to-Exposed Pad
K
0.20
–
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-105B
© 2007 Microchip Technology Inc.
DS20090C-page 31
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