MC74VHC1G02 Ver la hoja de datos (PDF) - ON Semiconductor
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MC74VHC1G02 Datasheet PDF : 6 Pages
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MC74VHC1G02
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
PD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, VCC and GND
Power Dissipation in Still Air at 85°C
−0.5 to +7.0
V
−0.5 to +7.0
V
VCC = 0
−0.5 to 7.0
V
High or Low State
−0.5 to VCC + 0.5
−20
mA
VOUT < GND; VOUT > VCC
+20
mA
+25
mA
+50
mA
SC70−5/SC−88A
150
mW
TSOP−5
200
qJA
Thermal Resistance
SC70−5/SC−88A (Note 1)
350
TSOP−5
230
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
)150
°C
TSTG
Storage Temperature Range
*65 to )150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
> 2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
ILATCHUP Latchup Performance
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
VIN
VOUT
TA
tr , tf
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
Min
2.0
0.0
0.0
−55
VCC = 3.3 V $ 0.3 V
0
VCC = 5.0 V $ 0.5 V
0
Max
5.5
5.5
VCC
+125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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