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MC33030 Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
MC33030
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC33030 Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
A
A
16
1
F
E
G
MC33030
PACKAGE DIMENSIONS
B
9
8
PDIP−16
P SUFFIX
CASE 648C−04
ISSUE D
T
SEATING
PLANE
16X D
0.005 (0.13) M T A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.744 0.783 18.90 19.90
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
E 0.050 BSC
1.27 BSC
F 0.040 0.70 1.02 1.78
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC
7.62 BSC
M
0_ 10_ 0_ 10_
N 0.015 0.040 0.39 1.01
D
A
16
9
SO−16 WB
CASE 751G−03
ISSUE C
q
1
8
16X B
B
0.25 M T A S B S
14X e
SEATING
PLANE
T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0_ 7_
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