MC13156 Ver la hoja de datos (PDF) - Motorola => Freescale
Número de pieza
componentes Descripción
Fabricante
MC13156 Datasheet PDF : 20 Pages
| |||
24
25
MC13156
OUTLINE DIMENSIONS
FB SUFFIX
PLASTIC QFP PACKAGE
CASE 873–01
ISSUE A
L
17
16
–A–
L
–B–
B
32
1
DETAIL A
9
8
–D–
A
0.20 (0.008) M C A–B S D S
0.05 (0.002) A–B
S
0.20 (0.008) M H A–B S D S
V
B
B
P
–A–, –B–, –D–
DETAIL A
BASE
F
METAL
CE
–C–
SEATING
PLANE
H
G
M
DETAIL C
–H–
DATUM
PLANE
0.01 (0.004)
M
J
N
D
0.20 (0.008) M C A–B S D S
SECTION B–B
VIEW ROTATED 90 _CLOCKWISE
–H–
DATUM
PLANE
U
T
R
DETAIL C
K
Q
X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 6.95 7.10 0.274 0.280
B 6.95 7.10 0.274 0.280
C 1.40 1.60 0.055 0.063
D 0.273 0.373 0.010 0.015
E 1.30 1.50 0.051 0.059
F 0.273 ––– 0.010 –––
G
0.80 BSC
0.031 BSC
H ––– 0.20 ––– 0.008
J 0.119 0.197 0.005 0.008
K 0.33 0.57 0.013 0.022
L
5.6 REF
0.220 REF
M 6_ 8_ 6_ 8_
N 0.119 0.135 0.005 0.005
P
0.40 BSC
0.016 BSC
Q
5_ 10_ 5 _ 10_
R 0.15 0.25 0.006 0.010
S 8.85 9.15 0.348 0.360
T 0.15 0.25 0.006 0.010
U
5_ 11_ 5 _ 11_
V 8.85 9.15 0.348 0.360
X
1.00 REF
0.039 REF
MOTOROLA WIRELESS SEMICONDUCTOR
19
SOLUTIONS – RF AND IF DEVICE DATA
Share Link: 