MC100E143FNR2 Ver la hoja de datos (PDF) - ON Semiconductor
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MC100E143FNR2 Datasheet PDF : 8 Pages
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MC10E143, MC100E143
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9)
0°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
fSHIFT
tPLHt
PHL
Max. Shift Frequency
Propagation Delay To Output
700
Clk 600
MR 600
900
700
800 1000 600
800 1000 600
900
700
800 1000 600
800 1000 600
900
MHz
ps
800 1000
800 1000
ts
Setup Time
ps
D 50 −100
50 −100
50 −100
SEL 300 150
300 150
300 150
th
Hold Time
ps
D 300 100
300 100
300 100
SEL 75 −150
75 −150
75 −150
tRR
Reset Recovery Time
900 700
900 700
900 700
ps
tPW
Minimum Pulse Width
ps
Clk, MR 400
400
400
tSKEW
tJITTER
tr
tf
Within-Device Skew (Note 10)
Random Clock Jitter (RMS)
Rise/Fall Times
(20 - 80%)
75
75
75
ps
<1
<1
<1
ps
ps
300 525 800 300 525 800 300 525 800
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
Q
Driver
Device
Q
Zo = 50 W
Zo = 50 W
50 W
50 W
D
Receiver
Device
D
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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