MAX6816EUS Ver la hoja de datos (PDF) - Maxim Integrated

Número de pieza

componentes Descripción

Fabricante

MAX6816EUS

PLASTIC ENCAPSULATED DEVICES

Maxim Integrated 

II. Manufacturing Information

A. Description/Function:

B. Process:

C. Number of Device Transistors:

D. Fabrication Location:

E. Assembly Location:

F. Date of Initial Production:

±15kV ESD-Protected, Single CMOS Switch Debouncers

S3 (Standard 3 micron silicon gate CMOS)

284

Oregon, USA

Malaysia or Thailand

January, 1999

III. Packaging Information

A. Package Type:

4-Pin SOT143

B. Lead Frame:

Alloy 42 or Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-Filled Epoxy

E. Bondwire:

Gold (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

# 05-1601-0055

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

43 x 30 mils

B. Passivation:

C. Interconnect:

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

Aluminum/Si (Si = 1%)

D. Backside Metallization:

None

E. Minimum Metal Width:

3 microns (as drawn)

F. Minimum Metal Spacing: 3 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

I. Die Separation Method:

SiO2

Wafer Saw

Share Link: