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MAX3203

Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces

Maxim Integrated 

Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD

Protection Arrays for High-Speed Data Interfaces

ABSOLUTE MAXIMUM RATINGS

VCC to GND ...........................................................-0.3V to +7.0V

I/O_ to GND ................................................-0.3V to (VCC + 0.3V)

Continuous Power Dissipation (TA = +70°C)

2 × 2 WLP (derate 11.5mW/°C above +70°C)...............920mW

3 × 2 WLP (derate 12.3mW/°C above +70°C)...............984mW

3 × 3 WLP (derate 14.1mW/°C above +70°C).............1128mW

6-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW

12-Pin TQFN (derate 16.9mW/°C above +70°C) ........1349mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature .....................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

4 WLP

Junction-to-Ambient Thermal Resistance (θJA)...............87°C/W

6 WLP

Junction-to-Ambient Thermal Resistance (θJA)...............84°C/W

9 WLP

Junction-to-Ambient Thermal Resistance (θJA)...............71°C/W

6 TDFN

Junction-to-Ambient Thermal Resistance (θJA)....................42°C/W

Junction-to-Case Thermal Resistance (θJC)...........................9°C/W

12 TQFN

Junction-to-Ambient Thermal Resistance (θJA)....................41°C/W

Junction-to-Case Thermal Resistance (θJC)...........................6°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VCC = +5V ±5%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

Supply Current

Diode Forward Voltage

VCC

ICC

VF

IF = 10mA

0.9

5.5

V

1

100

nA

0.65

0.95

V

TA = +25°C, ±15kV

Human Body Model,

IF = 10A

Positive transients

Negative transients

VCC + 25

-25

Channel Clamp Voltage

(Note 3)

TA = +25°C, ±8kV

Positive transients

VC

Contact Discharge

(IEC 61000-4-2), IF = 24A Negative transients

VCC + 60

V

-60

Channel Leakage Current

Channel Input Capacitance

ESD PROTECTION

TA = +25°C, ±15kV

Air-Gap Discharge

(IEC 61000-4-2), IF = 45A

Positive transients

Negative transients

TA = 0°C to +50°C (Note 4)

VCC = 5V, bias of VCC/2

VCC + 100

-100

-1

+1

nA

5

7

pF

Human Body Model

±15

kV

IEC 61000-4-2

Contact Discharge

±8

kV

IEC 61000-4-2

Air-Gap Discharge

±15

kV

Note 2: Limits over temperature are guaranteed by design, not production tested.

Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the Applications Information section for more information.

Note 4: Guaranteed by design. Not production tested.

2 _______________________________________________________________________________________

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