M95160-RMC6T(2014) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

M95160-RMC6T
(Rev.:2014)

16-Kbit serial SPI bus EEPROM with high-speed clock

STMicroelectronics 

M95160 M95160-W M95160-R M95160-DF

Package mechanical data

Figure 25. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat no lead, package

outline



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1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 23. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

A1

b

D

D2 (rev MC)

E

E2 (rev MC)

e

K (rev MC)

L

L1

L3

eee(2)

0.550

0.020

0.250

2.000

-

3.000

-

0.500

-

-

-

-

-

0.450

0.000

0.200

1.900

1.200

2.900

1.200

-

0.300

0.300

-

0.300

0.080

0.600

0.050

0.300

2.100

1.600

3.100

1.600

-

-

0.500

0.150

-

-

0.0217

0.0008

0.0098

0.0787

-

0.1181

-

0.0197

-

-

-

-

-

0.0177

0.0000

0.0079

0.0748

0.0472

0.1142

0.0472

-

0.0118

0.0118

-

0.0118

0.0031

0.0236

0.0020

0.0118

0.0827

0.0630

0.1220

0.0630

-

-

0.0197

0.0059

-

-

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

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