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M95160-RMN3 Ver la hoja de datos (PDF) - STMicroelectronics

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M95160-RMN3 Datasheet PDF : 40 Pages
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M95160, M95080
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 8. may cause permanent damage to the de-
vice. These are stress ratings only, and operation
of the device at these, or any other conditions out-
side those indicated in the Operating sections of
this specification, is not implied. Exposure to Ab-
solute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 8. Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
TSTG
Storage Temperature
–65
150
°C
TLEAD
Lead Temperature during Soldering
See note 1
°C
VO
Output Voltage
–0.50 VCC+0.6
V
VI
Input Voltage
–0.50
6.5
V
VCC
Supply Voltage
–0.50
6.5
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
–4000
4000
V
Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500, R2=500)
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