M36P0R9070E0 Ver la hoja de datos (PDF) - Numonyx -> Micron
Número de pieza
componentes Descripción
Fabricante
M36P0R9070E0 Datasheet PDF : 23 Pages
| |||
M36P0R9070E0
6
Package mechanical
Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
Figure 6.
TFBGA107 8 × 11mm - 9 × 12 active ball array, 0.8mm pitch, package
outline
D
D1
FD
E E1
BALL "B1"
Ae
1. Drawing is not to scale.
e
SE
FE
b
A2
A1
ddd
BGA-Z85
19/23
Share Link: 