LTM4612 Ver la hoja de datos (PDF) - Linear Technology
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LTM4612 Datasheet PDF : 24 Pages
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LTM4612
APPLICATIONS INFORMATION
Table 4. 5V Output
DERATING CURVE
Figures 18, 21
Figures 18, 21
Figures 18, 21
Figures 10, 13, 16
Figures 10, 13, 16
Figures 10, 13, 16
VIN (V)
36
36
36
36
36
36
POWER LOSS CURVE
Figure 10
Figure 10
Figure 10
Figure 10
Figure 10
Figure 10
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θJA (°C/W)
14.9
11.1
10
14
10.4
9.3
Heat Sink Manufacturer
Wakeï¬eld Engineering
Part No: LTN20069
Phone: 603-635-2800
Safety Considerations
The LTM4612 modules do not provide isolation from VIN
to VOUT. There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure.
Layout Checklist/Example
The high integration of LTM4612 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Use large PCB copper areas for high current path, in-
cluding VIN, PGND and VOUT. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the VD, PGND and VOUT pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• Use round corners for the PCB copper layer to minimize
the radiated noise.
• To minimize the EMI noise and reduce module thermal
stress, use multiple vias for interconnection between
top layer and other power layers.
• Do not put vias directly on pads.
• If vias are placed onto the pads, the the vias must be
capped.
• Interstitial via placement can also be used if necessary.
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
• Place one or more high frequency ceramic capacitors
close to the connection into the system board.
Figure 17 gives a good example of the recommended
layout.
VIN
CIN CIN
GND
SIGNAL
GND
COUT
VOUT
COUT
4612 F17
Figure 17. Recommended PCB Layout
4612f
17
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