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LTC3418 Ver la hoja de datos (PDF) - Linear Technology

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LTC3418 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
PACKAGE DESCRIPTION
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
0.70 p 0.05
5.50 p 0.05
4.10 p 0.05
3.00 REF
5.15 ± 0.05
3.15 ± 0.05
LTC3418
0.25 p 0.05
0.50 BSC
5.5 REF
6.10 p 0.05
7.50 p 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 p 0.10
PIN 1
TOP MARK
(SEE NOTE 6)
0.75 p 0.05
0.00 – 0.05
PACKAGE
OUTLINE
3.00 REF
37 38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 s 45o CHAMFER
0.40 p0.10
1
2
7.00 p 0.10
5.50 REF
5.15 ± 0.10
3.15 ± 0.10
0.200 REF 0.25 p 0.05
0.50 BSC
R = 0.125
TYP
BOTTOM VIEW—EXPOSED PAD
(UH) QFN REF C 1107
R = 0.10
TYP
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibilit y is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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