DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

LTC1740IGPBF Ver la hoja de datos (PDF) - Linear Technology

Número de pieza
componentes Descripción
Fabricante
LTC1740IGPBF
Linear
Linear Technology Linear
LTC1740IGPBF Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
LTC1740
APPLICATIO S I FOR ATIO
As with all fast ADCs, the noise performance of the
LTC1740 is sensitive to clock jitter when high speed inputs
are present. The SNR performance of an ADC when the
performance is limited by jitter is given by:
SNR = – 20log (2π fINtJ)dB
where fIN is the frequency of an input sine wave and tJ is
the root-mean-square jitter due to the clock, the analog
input and the A/D aperture jitter. To minimize clock jitter,
use a clean clock source such as a crystal oscillator, treat
the clock signals as sensitive analog traces and use
dedicated packages with good supply bypassing for any
clock drivers.
Board Layout
To obtain the best performance from the LTC1740, a
printed circuit board with a ground plane is required.
Layout for the printed circuit board should ensure that
digital and analog signal lines are separated as much as
possible. In particular, care should be taken not to run any
digital track alongside an analog signal track.
An analog ground plane separate from the logic system
ground should be placed under and around the ADC.
Pins␣ 6, 7, 10, 31, 34 (GND), Pins 11, 28 (OGND) and all
other analog grounds should be connected to this ground
plane. In single supply mode, Pins 29, 30 (VSS) should
also be connected to this ground plane. All bypass capaci-
tors for the LTC1740 should also be connected to this
ground plane (Figure 12). The digital system ground
should be connected to the analog ground plane at only
one point, near the OGND pin (Pin 28).
The analog ground plane should be as close to the ADC as
possible. Care should be taken to avoid making holes in the
analog ground plane under and around the part. To ac-
complish this, we recommend placing vias for power and
signal traces outside the area containing the part and the
decoupling capacitors (Figure 13).
Supply Bypassing
High quality, low series resistance ceramic 1µF capacitors
should be used at the VDD pins, VCM and VREF. If VSS is
connected to – 5V it should also be bypassed to ground
with 1µF. In single supply operation VSS should be shorted
to the ground plane as close to the part as possible. OVDD
requires a 1µF decoupling capacitor to ground. Surface
mount capacitors such as the AVX 0805ZC105KAT pro-
vide excellent bypassing in a small board space. The traces
connecting the pins and the bypass capacitors must be
kept short and should be made as wide as possible.
PLACE NON-GROUND
VIAS AWAY FROM
GROUND PLANE AND
BYPASS CAPACITORS
LTC1740
AVOID BREAKING GROUND PLANE
IN THIS AREA
BYPASS
CAPACITOR
ANALOG
GROUND
PLANE
1740 F13
Figure 13. Cross Section of the LTC1740 Printed Circuit Board
1000pF
ANALOG
INPUT
CIRCUITRY
+–
1 +AIN
LTC1740
2 –AIN VCM
3
VREF GND GND VDD VDD GND OGND OVDD
5
6 7 8 9 10 11 19
VSS VSS GND VDD VDD GND OGND
29 30 31 32 33 34 28
1µF
1µF
1µF
1µF
1µF
1µF
DIGITAL
SYSTEM
ANALOG GROUND PLANE
1740 F12
Figure 12. Power Supply Grounding
1740f
14

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]