LT1965 Series
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PIN 1
PACKAGE TOP MARK
OUTLINE (NOTE 6)
0.25 ± 0.05
0.50 BSC
0.200 REF
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
(DD) DFN 1203
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 ± 0.102
1
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.42 ± 0.038
(.0165 ± .0015)
0.65
(.0256)
8
TYP
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
GAUGE
PLANE
DETAIL “A”
0° – 6° TYP
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR
GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.152mm (.006") PER SIDE
18
DETAIL “A”
1 234
1.10
(.043)
MAX
0.86
(.034)
REF
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8E) 0603
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
1965fa