LPC1751FBD80 Ver la hoja de datos (PDF) - NXP Semiconductors.

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LPC1751FBD80

32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN

NXP Semiconductors. 

NXP Semiconductors

10.1

Thermal characteristics. . . . . . . . . . . . . . . . . . 39

11

Static characteristics. . . . . . . . . . . . . . . . . . . . 40

11.1

Power consumption . . . . . . . . . . . . . . . . . . . . 43

11.2

Peripheral power consumption . . . . . . . . . . . . 46

11.3

Electrical pin characteristics . . . . . . . . . . . . . . 47

12

Dynamic characteristics . . . . . . . . . . . . . . . . . 49

12.1

Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . 49

12.2

External clock . . . . . . . . . . . . . . . . . . . . . . . . . 49

12.3

Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 50

12.4

I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

12.5

I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

12.6

I2S-bus interface (LPC1759/58/56 only) . . . . . 53

12.7

SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 55

12.8

USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 57

12.9

SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

13

ADC electrical characteristics . . . . . . . . . . . . 60

14

DAC electrical characteristics

(LPC1759/58/56/54 only) . . . . . . . . . . . . . . . . . 63

15

Application information. . . . . . . . . . . . . . . . . . 64

15.1

Suggested USB interface solutions . . . . . . . . 64

15.2

Crystal oscillator XTAL input and component

selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

15.3

XTAL Printed-Circuit Board (PCB) layout

guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

15.4

Standard I/O pin configuration . . . . . . . . . . . . 69

15.5

Reset pin configuration . . . . . . . . . . . . . . . . . . 70

15.6

ElectroMagnetic Compatibility (EMC) . . . . . . . 71

16

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 72

17

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

18

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 74

19

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

20

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 75

21

Legal information. . . . . . . . . . . . . . . . . . . . . . . 77

21.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 77

21.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

21.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

21.4

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 78

22

Contact information. . . . . . . . . . . . . . . . . . . . . 78

23

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

© NXP Semiconductors N.V. 2015.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 August 2015

Document identifier: LPC1759_58_56_54_52_51

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