L6230
2.3
Electrical data
Thermal data
Table 4. Thermal data
Symbol
Parameter
Value
Unit
PowerSO36 QFN32
Rth(j-amb)1 Maximum thermal resistance junction-ambient (1)
Rth(j-amb)1 Maximum thermal resistance junction-ambient (2)
Rth(j-amb)2 Maximum thermal resistance junction-ambient (3)
Rth(j-amb)3 Maximum thermal resistance junction-ambient (4)
36
-
°C/W
16
-
°C/W
63
-
°C/W
-
42 °C/W
1. Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a
thickness of 35 µm).
2. Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a
thickness of 35 µm), 16 via holes and a ground layer.
3. Mounted on a multi-layer FR4 PCB without any heat-sinking surface on the board.
4. Mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm2 on the top side plus 6
cm2 ground layer connected through 18 via holes (9 below the IC).
Doc ID 18094 Rev 2
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