KTY81-2 Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
KTY81-2 Datasheet PDF : 16 Pages
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Philips Semiconductors
Silicon temperature sensors
Product specification
KTY81-2 series
Table 5 Tape specification
SYMBOL
DIMENSION
MIN.
A1
body width
4.4
A
body height
5
T
body thickness
3.6
P
pitch of component
−
P0
feed hole pitch
−
cumulative pitch error
−
P2
feed hole centre to component −
centre
F
lead-to-lead distance
spread leads
−
straight leads
−
∆h
component alignment
−
W
tape width
−
W0
hold-down tape width
−
W1
hole position
−
W2
hold-down tape position
−
H0
lead wire clinch height
−
H1
component height
−
L
length of snipped leads
−
D0
feed hole diameter
−
t
total tape thickness
−
F1, F2
lead to snipped lead distance
spread leads
−
straight leads
−
H2
clinch height
−
(p)
pull-out force
6
SPECIFICATIONS
NOM. MAX. TOL.
−
4.8 −
−
5.2 −
−
4.2 −
12.7 −
±1
12.7 −
±0.3
−
−
±0.1
6.35 −
±0.4
5.08 −
+0.6/−0.2
2.54 −
+0.6/−0.2
0
1
−
18
−
±0.5
6
−
±0.2
9
−
+0.7/−0.5
0.5 −
±0.2
16.5 −
±0.5
−
23.25 −
−
11
−
4
−
±0.2
−
1.2 −
2.54 −
1.27 −
2.5 −
−
−
+0.4/−0.2
+0.4/−0.2
+0.5/0
−
UNIT
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
N
REMARKS
note 1
to be measured at bottom
of clinch
at top of body
t1 = 0.3 to 0.6
Note
1. Measured over 20 devices.
2000 Aug 25
12
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