KP-1608SECK(2002) Ver la hoja de datos (PDF) - Kingbright
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KP-1608SECK Datasheet PDF : 4 Pages
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KP-1608SECK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: KDA0022
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 4 OF 4
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