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MK53X256CLQ100

K53 Sub-Family Data Sheet

Freescale Semiconductor 

4. 15pF load

Peripheral operating requirements and behaviors

5.3 Thermal specifications

5.3.1 Thermal operating requirements

Table 9. Thermal operating requirements

Symbol

TJ

TA

Description

Die junction temperature

Ambient temperature

Min.

Max.

Unit

–40

125

°C

–40

85

°C

5.3.2 Thermal attributes

Board

type

Single-

layer (1s)

Four-layer

(2s2p)

Single-

layer (1s)

Four-layer

(2s2p)

—

—

—

Symbol

RθJA

RθJA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Description

Thermal resistance, junction to ambient (natural

convection)

Thermal resistance, junction to ambient (natural

convection)

Thermal resistance, junction to ambient (200 ft./

min. air speed)

Thermal resistance, junction to ambient (200 ft./

min. air speed)

Thermal resistance, junction to board

Thermal resistance, junction to case

Thermal characterization parameter, junction to

package top outside center (natural convection)

144

LQFP

52

44

43

38

33

11

2

144 Unit

MAPBGA

50

°C/W

30

°C/W

41

°C/W

27

°C/W

17

°C/W

10

°C/W

2

°C/W

Notes

1

1

1

1

2

3

4

1.

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method

Environmental Conditions—Forced Convection (Moving Air).

6 Peripheral operating requirements and behaviors

All digital I/O switching characteristics assume:

1. output pins

• have CL=30pF loads,

• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and

• are configured for high drive strength (PORTx_PCRn[DSE]=1)

K53 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

21

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