ISL9021A Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
ISL9021A Datasheet PDF : 10 Pages
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Wafer Level Chip Scale Package
(WLCSP 0.4mm Ball Pitch)
D
E
PIN 1
TOP VIEW
A2
A1
A
b
SIDE VIEW
ISL9021A
W2x2.4
2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL
MILLIMETERS
A
0.44 Min, 0.495 Nom, 0.55 Max
A1
0.190 ±0.030
A2
0.305 ±0.025
b
0.270 ±0.030
D
1.155 ±0.020
D1
0.400 BASIC
E
0.975 ±0.020
E1
0.400 BASIC
e
0.400 BASIC
SD
0.200 BASIC
SE
0.00 BASIC
NUMBER OF BUMPS: 4
Rev. 2 6/08
NOTES:
1. All dimensions are in millimeters.
e ( D1 )
2
SE
e ( E1 )
1
B
A
b
SD
BOTTOM VIEW
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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10
FN7845.0
May 27, 2011
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