IS24C02A Ver la hoja de datos (PDF) - Integrated Silicon Solution

Número de pieza

componentes Descripción

Fabricante

IS24C02A

1K-bit/2K-bit/4K-bit/8K-bit/16K-bit 2-WIRE SERIAL CMOS EEPROM

Integrated Silicon Solution 

PACKAGING INFORMATION

Plastic MSOP

Package Code: S

ISSI ®

N

1

D

E1 E

SEATING PLANE

A

A1

L

e

α

C

B

Ref. Std.

Plastic MSOP (S)

JEDEC MO 187

No. Leads

8 (120 mil)

Inches

Symbol Min Max

A 0.038 0.043

A1 0.002 0.006

B 0.010 0.016

C 0.005 0.009

D 0.114 0.122

E 0.193BSC

E1 0.114 0.122

e 0.0256BSC

L — 0.022

α — 7°

Millimeters

Min Max

0.97 1.10

0.05 0.15

0.25 0.40

0.13 0.23

2.90 3.10

4.90 BSC

2.90 3.10

0.65 BSC

— 0.55

— 7°

Notes:

1. Controlling dimension: inches, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect to

one another within 0.004 inches at the

seating plane.

ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may

appear in this publication. © Copyright 2002, Integrated Silicon Solution, Inc.

Integrated Silicon Solution, Inc. — 1-800-379-4774

Rev. D 02/01/02

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