HSP061-4NY8 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

HSP061-4NY8

4-line ESD protection for high speed lines

STMicroelectronics 

HSP061-4NY8

Recommendation on PCB assembly

3.3

PCB design

1. To control the solder paste amount, the closed via is recommended instead of open

vias.

2. The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

Figure 13. Printed circuit board layout recommendations

400 µm

Via to

GND

1

8

2

3

7

Via to

GND

4

5

6

Footprint pad

PCB tracks

3.4

Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

100

0.9 °C/s

50

0

30

60

90

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s

-3 °C/s

-6 °C/s

Time (s)

120 150 180 210 240 270 300

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.

Doc ID 17414 Rev 5

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