HSP061-4NY8 Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
HSP061-4NY8 Datasheet PDF : 9 Pages
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Package information
2
Package information
HSP061-4NY8
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 8. µQFN-8L dimension definitions
D
e
b
Pin 1 ID
A
E
r
L
m
p
n
A1
Table 3. µQFN-8L dimensions
Dimensions
Ref
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.02
0.05
0.00
0.001
0.002
b
0.15
0.20
0.25
0.006
0.008
0.010
D
1.95
2.00
2.05
0.077
0.079
0.081
E
0.95
1.00
1.05
0.037
0.039
0.041
e
0.35
0.40
0.45
0.014
0.016
0.018
L
0.25
0.35
0.45
0.010
0.014
0.018
m
0.40
0.016
n
0.15
0.006
p
0.11
0.004
r
0.05
0.002
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Doc ID 17414 Rev 5
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