HSP061-4M10 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

HSP061-4M10

4-line ESD protection for high speed lines

STMicroelectronics 

HSP061-4M10

PCB design preference

3.3

PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open vias.

2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is

recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.

Figure 14. Printed circuit board layout recommendations

500 µm

1

10

Via to

GND

Via to

GND

3.4

Note:

Note:

5

6

Footprint pad

PCB tracks

Reflow profile

Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

100

0.9 °C/s

50

0

30

60

90

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s

-3 °C/s

-6 °C/s

Time (s)

120 150 180 210 240 270 300

Minimize air convection currents in the reflow oven to avoid component movement.

Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.

DS9279 - Rev 4

page 7/10

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